Hysol
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When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol® line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturing.
In 1948, a young chief chemist from the Daystrom Furniture Corporation harnessed his entrepreneurial spirit and began the Vilex Corporation, an Olean, New York -based company that engaged in the custom dip coating of electroplating racks. Signing on his former employer as his first customer, Russell Haughton’s Vilex Corporation enjoyed rapid expansion and prosperity as well as a name change: Vilex Corporation became Haughton Laboratories. The ingenuity of the company led to several chemical advancements, the most notable of which was the formulation of
plastisols –high solids content liquids with a very low percentage of volatiles as compared to paints. And so was born the name Hysol (for high solids), which became the brand name for all the company’s products.
Rapid Global Expansion and Product Innovation
Never satisfied to rest on its laurels, the company’s profits were invested in Swiss research and development of a new material called epoxy resin. Using these imported materials nearly two years prior to their commercial availability in the United States, Haughton Laboratories became the first American firm to adapt the unique properties of these resins for use in electrical insulating compounds, adhesives and sealants.
The next several decades proved no different for innovative market firsts than did the early years of the company. As the company’s product line was expanding, so was its geographic presence and corporate leadership and Haughton Laboratories, through acquisition, joint ventures and organic growth, established manufacturing and sales offices across North America. The company eventually changed its name to reflect its popular brand of products and, in 1960 officially became Hysol Corporation. Global expansion began in 1965, with the formation of Hysol International in Chiswick, UK near London. Two years following, the company merged with Dexter Corporation, the oldest company listed on the New York Stock Exchange, to become the Hysol Divison of The Dexter Corporation.
Though there were numerous corporate identity changes over the company’s history, one thing remained constant: the persistent focus on product innovation, company growth and the advancement of electronics capability through new, unique materials. Such products as adhesives, opto-electronic device encapsulants, semiconductor encapsulants, biomedical-grade and urethanes.
In 1999, Henkel Corporation acquired The Dexter Corporation and has continued the unrivalled product development and leading-edge manufacturing solutions that have been associated with the Hysol brand name since its inception.
